Viscous dissipation in finite thin-gap Couette devices

Michael C. Wendl, Ramesh K. Agarwal

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

An analytical solution is reported for the temperature distribution in finite span thin-gap Couette devices which accounts for viscous dissipation. Taken in conjunction with an established solution for the stable velocity profile, this result describes the standard experimental configuration where no external heat fluxes are applied. We discuss physical aspects as well as conditions for which classical one-dimensional theory should be replaced by the present result.

Original languageEnglish
Pages (from-to)200-202
Number of pages3
JournalJournal of Heat Transfer
Volume124
Issue number1
DOIs
StatePublished - Feb 1 2002

Keywords

  • Analytical
  • Conduction
  • Flow
  • Heat transfer
  • Laminar

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