TY - GEN
T1 - Self-powered system-on-chip for substrate computing and ultrasonic communications
AU - Alazzawi, Yarub
AU - Chakrabartty, Shantanu
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/9/27
Y1 - 2017/9/27
N2 - Substrate computing refers to a paradigm where sensing, computing, communications, energy scavenging and energy storage functions are seamlessly integrated within a substrate. The substrate could be a part of an aircraft wing or a chassis of the car and the computing, communications and energy scavenging functions could be implemented using self-powered devices embedded inside the substrate. In this paper we present the design of a CMOS transceiver that could be used for through-substrate communications using ultrasonic pulses. The transceiver comprises of three piezoelectric interfaces, one of which is used for harvesting and regulating energy from mechanical vibrations in the substrate and the other two interfaces are used for transmitting and receiving ultrasonic pulses. We present measurement results using prototypes of the transceiver fabricated in a 0.5-μm CMOS process integrated with piezoelectric transducers that are attached to a segment of an aluminum wing. The results demonstrate the energy-harvesting, regulation functionalities along with the bi-directional telemetry functions needed to implement a complete transceiver for substrate computing.
AB - Substrate computing refers to a paradigm where sensing, computing, communications, energy scavenging and energy storage functions are seamlessly integrated within a substrate. The substrate could be a part of an aircraft wing or a chassis of the car and the computing, communications and energy scavenging functions could be implemented using self-powered devices embedded inside the substrate. In this paper we present the design of a CMOS transceiver that could be used for through-substrate communications using ultrasonic pulses. The transceiver comprises of three piezoelectric interfaces, one of which is used for harvesting and regulating energy from mechanical vibrations in the substrate and the other two interfaces are used for transmitting and receiving ultrasonic pulses. We present measurement results using prototypes of the transceiver fabricated in a 0.5-μm CMOS process integrated with piezoelectric transducers that are attached to a segment of an aluminum wing. The results demonstrate the energy-harvesting, regulation functionalities along with the bi-directional telemetry functions needed to implement a complete transceiver for substrate computing.
UR - http://www.scopus.com/inward/record.url?scp=85034091769&partnerID=8YFLogxK
U2 - 10.1109/MWSCAS.2017.8053012
DO - 10.1109/MWSCAS.2017.8053012
M3 - Conference contribution
AN - SCOPUS:85034091769
T3 - Midwest Symposium on Circuits and Systems
SP - 671
EP - 674
BT - 2017 IEEE 60th International Midwest Symposium on Circuits and Systems, MWSCAS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2017
Y2 - 6 August 2017 through 9 August 2017
ER -