Polymer/metal interfacial crack growth characterized by C

This paper establishes a simple testing scheme to simultaneously measure the linear elastic strain energy release rate G, the non-linear J-integral, and the rate-dependent C*-integral for a growing crack at a polymer/metal interface. The test is applicable to fracture of adhesive bonds. A criterion governing C*-controlled fracturing is derived, analogous to the Hutchinson-Paris ω-criterion for J-controlled growth. The interfacial toughness of an adhesive commonly used for bonding metal plates is characterized at room temperature, and is shown to fracture in a C* -controlled manner. A relationship between C* and the crack growth rate is observed. The nature of this relationship warrants further exploration.