TY - GEN
T1 - Infrasonic power-harvesting and nanowatt self-powered sensors
AU - Chakrabartty, Shantanu
AU - Lajnef, Nizar
PY - 2009
Y1 - 2009
N2 - Many signals of interest in structural engineering, for example seismic activity, lie in the infrasonic range (frequency less than 20 Hz). This poses a significant challenge for developing batteryless sensors that are required not only to monitor rare infrasonic events but also to harvest the energy for sensing, computation and storage from the signal being monitored. In this paper, we show that a linear injection response of our previously reported piezo-floating-gate sensor is ideal for self-powered sensing and computation of infrasonic signals. Our experimental results demonstrate that the sensor fabricated in a 0.5μm CMOS technology can compute and record level crossing statistics of an input seismic event. Collected data are in good agreement with results obtained using a standard data acquisition system. Also, the sensor consumes less than 100nA of current, which makes its operation based on infrasonic power-harvesting feasible.
AB - Many signals of interest in structural engineering, for example seismic activity, lie in the infrasonic range (frequency less than 20 Hz). This poses a significant challenge for developing batteryless sensors that are required not only to monitor rare infrasonic events but also to harvest the energy for sensing, computation and storage from the signal being monitored. In this paper, we show that a linear injection response of our previously reported piezo-floating-gate sensor is ideal for self-powered sensing and computation of infrasonic signals. Our experimental results demonstrate that the sensor fabricated in a 0.5μm CMOS technology can compute and record level crossing statistics of an input seismic event. Collected data are in good agreement with results obtained using a standard data acquisition system. Also, the sensor consumes less than 100nA of current, which makes its operation based on infrasonic power-harvesting feasible.
UR - http://www.scopus.com/inward/record.url?scp=70350150201&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2009.5117709
DO - 10.1109/ISCAS.2009.5117709
M3 - Conference contribution
AN - SCOPUS:70350150201
SN - 9781424438280
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 157
EP - 160
BT - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
T2 - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Y2 - 24 May 2009 through 27 May 2009
ER -