TY - GEN
T1 - Freestanding nanomembranes from materials innovation to AI hardware
AU - Bae, Sang Hoon
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The key player for the next-generation hardware will be ubiquitous electronics with artificial intelligence (AI). Electronics has become essential to human lives and the advancement of AI allows us to incorporate it to innovation in electronics. To realize electronics everywhere and to improve these emerging AI-based applications, innovation in materials and electronic devices is mandatory. Current electronics has been dominated by rigid materials, but there are clear fundamental limitations in the rigid materials as they do not satisfy required mechanical property for future application such as biomedical devices, flexible devices and wearable devices.
AB - The key player for the next-generation hardware will be ubiquitous electronics with artificial intelligence (AI). Electronics has become essential to human lives and the advancement of AI allows us to incorporate it to innovation in electronics. To realize electronics everywhere and to improve these emerging AI-based applications, innovation in materials and electronic devices is mandatory. Current electronics has been dominated by rigid materials, but there are clear fundamental limitations in the rigid materials as they do not satisfy required mechanical property for future application such as biomedical devices, flexible devices and wearable devices.
UR - http://www.scopus.com/inward/record.url?scp=85182019969&partnerID=8YFLogxK
U2 - 10.1109/NMDC57951.2023.10344254
DO - 10.1109/NMDC57951.2023.10344254
M3 - Conference contribution
AN - SCOPUS:85182019969
T3 - 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
SP - 457
BT - 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
Y2 - 22 October 2023 through 25 October 2023
ER -