TY - JOUR
T1 - Evaporation-enhanced, dynamically adaptive air (Gas)-cooled heat sink for thermal management of high heat dissipation devices
AU - Fedorov, Andrei G.
AU - Meacham, J. Mark
PY - 2009/12
Y1 - 2009/12
N2 - To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device that enables significant enhancement of conventional air-cooled heat sinks using on-demand and spatially controlled droplet/jet impingement evaporative cooling. The device architecture modifies an air (gas)-cooled heat sink by adding a multiplexed, planar microelectromechanical system (MEMS)-based droplet ejector array as a capping surface of the finned structure of a conventional heat sink. Such a minimal modification of the heat sink allows one to exploit high heat flux evaporative cooling by virtue of delivering streams of liquid droplets or jets to the highly thermally conducting heat-spreading surface of the heat sink fins. The phase change associated with liquid droplet evaporation results in significant (∼ 50%) enhancement of the dissipated thermal load, beyond what could be achieved by using air (gas) cooling alone. Finally, among the additional key attractive features of the described technology is its ease of implementation (i.e., modification of commercially available heat sinks), paving the way to power-efficient, low-cost thermal management of high power dissipation devices.
AB - To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device that enables significant enhancement of conventional air-cooled heat sinks using on-demand and spatially controlled droplet/jet impingement evaporative cooling. The device architecture modifies an air (gas)-cooled heat sink by adding a multiplexed, planar microelectromechanical system (MEMS)-based droplet ejector array as a capping surface of the finned structure of a conventional heat sink. Such a minimal modification of the heat sink allows one to exploit high heat flux evaporative cooling by virtue of delivering streams of liquid droplets or jets to the highly thermally conducting heat-spreading surface of the heat sink fins. The phase change associated with liquid droplet evaporation results in significant (∼ 50%) enhancement of the dissipated thermal load, beyond what could be achieved by using air (gas) cooling alone. Finally, among the additional key attractive features of the described technology is its ease of implementation (i.e., modification of commercially available heat sinks), paving the way to power-efficient, low-cost thermal management of high power dissipation devices.
KW - Air-cooled heat sink
KW - Evaporation cooling
UR - http://www.scopus.com/inward/record.url?scp=72149090095&partnerID=8YFLogxK
U2 - 10.1109/TCAPT.2008.2011056
DO - 10.1109/TCAPT.2008.2011056
M3 - Article
AN - SCOPUS:72149090095
SN - 1521-3331
VL - 32
SP - 746
EP - 753
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 4
M1 - 4801569
ER -