TY - GEN
T1 - Design and characterization of a silver-enhanced gold nanoparticle-based biochip
AU - Liu, Yang
AU - Zhang, Deng
AU - Alocilja, Evangelyn
AU - Chakrabartty, Shantanu
PY - 2009
Y1 - 2009
N2 - Silver-enhanced labeling method that is employed in immunochromatographic assay provides an effective way of improving the sensitivity of detecting pathogens. In this paper, we apply the silver enhancement approach for providing signal amplification in conductimetric biochips which employ gold nanoparticles to bridge on a high-density microelectrode array for detecting gold nanoparticles. One of the measurement methods presented in this paper is the silver enhancing time that is shown to be an indicator of the concentration of gold nanoparticles. The method provides an alternative to existing detection methods and it is straightforward to achieve high-sensitivity in detection. The measured results presented in this paper are based on a high-density interdigital microelectrodes with a 4 μm gap where we show detection limits as low as 25 femtomolar.
AB - Silver-enhanced labeling method that is employed in immunochromatographic assay provides an effective way of improving the sensitivity of detecting pathogens. In this paper, we apply the silver enhancement approach for providing signal amplification in conductimetric biochips which employ gold nanoparticles to bridge on a high-density microelectrode array for detecting gold nanoparticles. One of the measurement methods presented in this paper is the silver enhancing time that is shown to be an indicator of the concentration of gold nanoparticles. The method provides an alternative to existing detection methods and it is straightforward to achieve high-sensitivity in detection. The measured results presented in this paper are based on a high-density interdigital microelectrodes with a 4 μm gap where we show detection limits as low as 25 femtomolar.
KW - Biochip
KW - Gold nanoparticle
KW - Micro-electrodes array
KW - Silver enhancement
UR - http://www.scopus.com/inward/record.url?scp=70350173902&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2009.5118292
DO - 10.1109/ISCAS.2009.5118292
M3 - Conference contribution
AN - SCOPUS:70350173902
SN - 9781424438280
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 2433
EP - 2436
BT - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
T2 - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Y2 - 24 May 2009 through 27 May 2009
ER -