Abstract
A theoretical model is presented to describe particle deposition to smooth, flat surfaces from turbulently-mixed gases. The deposition rate of inertialess particles is expressed in terms of a generalized external force which acts on the particles. Examples are given for particle deposition due to diffusion, sedimentation and electrostatic forces. Ranges for the dependent variables were chosen to reflect conditions which may be present near wafers during semiconductor device manufacture.
| Original language | English |
|---|---|
| Pages (from-to) | 1255-1261 |
| Number of pages | 7 |
| Journal | Chemical Engineering Science |
| Volume | 44 |
| Issue number | 5 |
| DOIs | |
| State | Published - 1989 |
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