TY - GEN
T1 - An Integrated Thermal Actuation/Sensing Array with Stacked Oscillators for Efficient and Localized Heating of Magnetic Nanoparticles with Sub-Millimeter Spatial Resolution
AU - Fan, Yingying
AU - Zhang, Linlin
AU - Zhang, Qingbo
AU - Bao, Gang
AU - Chi, Taiyun
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/2/13
Y1 - 2021/2/13
N2 - Magnetic nanoparticles (MNP) can generate localized thermal stress in response to an external ac magnetic field, offering unique opportunities for a wide range of biomedical applications. For example, hyperthermia cancer therapy, which raises the local temperature of tumors up to 43-45°C, can trigger apoptosis and disrupt cancer cells' ability to repair DNA damage [1]. In neuroscience, temperature-sensitive ion channels can be thermally activated using MNP-induced heating, which allows for minimally invasive brain stimulation [2,3]. Compared to dielectric heating and ohmic heating, MNP-based magnetic heating offers superior specificity and minimal damage to the surrounding tissues since most biological systems are non-magnetic.
AB - Magnetic nanoparticles (MNP) can generate localized thermal stress in response to an external ac magnetic field, offering unique opportunities for a wide range of biomedical applications. For example, hyperthermia cancer therapy, which raises the local temperature of tumors up to 43-45°C, can trigger apoptosis and disrupt cancer cells' ability to repair DNA damage [1]. In neuroscience, temperature-sensitive ion channels can be thermally activated using MNP-induced heating, which allows for minimally invasive brain stimulation [2,3]. Compared to dielectric heating and ohmic heating, MNP-based magnetic heating offers superior specificity and minimal damage to the surrounding tissues since most biological systems are non-magnetic.
UR - https://www.scopus.com/pages/publications/85102370411
U2 - 10.1109/ISSCC42613.2021.9365940
DO - 10.1109/ISSCC42613.2021.9365940
M3 - Conference contribution
AN - SCOPUS:85102370411
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 280
EP - 282
BT - 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021
Y2 - 13 February 2021 through 22 February 2021
ER -