TY - JOUR
T1 - Aluminum Oxide Thin Films from Aqueous Solutions
T2 - Insights from Solid-State NMR and Dielectric Response
AU - Cui, Jinlei
AU - Kast, Matthew G.
AU - Hammann, Blake A.
AU - Afriyie, Yvonne
AU - Woods, Keenan N.
AU - Plassmeyer, Paul N.
AU - Perkins, Cory K.
AU - Ma, Zayd L.
AU - Keszler, Douglas A.
AU - Page, Catherine J.
AU - Boettcher, Shannon W.
AU - Hayes, Sophia E.
N1 - Publisher Copyright:
© 2018 American Chemical Society.
PY - 2018/11/13
Y1 - 2018/11/13
N2 - Here, we employ a combination of 27Al solid-state nuclear magnetic resonance (SSNMR) and conventional spectroscopic and microscopic techniques to investigate the structural evolution of aqueous aluminum precursors to a uniform and smooth aluminum oxide film. The route involves no organic ligands and relies on dehydration, dehydroxylation, and nitrate loss for condensation and formation of the three-dimensional aluminum oxide structure. Local chemical environments are tracked as films evolve over the temperature range 200-1100 °C. 27Al SSNMR reveals that Al centers are predominantly four- and five-coordinate in amorphous films annealed between 200 and 800 °C and four- and six-coordinate in crystalline phases that form above 800 °C. The Al coordination of the aqueous-deposited aluminum oxide films are compared to data from SSNMR studies on vapor-phase-deposited aluminum oxide thin films. Additionally, dielectric constants of aluminum oxide-based capacitors are measured and correlated with the SSNMR results. Aluminum oxide is an important material for protective coatings, catalysis, and microelectronic applications. For the latter application, amorphous materials are preferred, but a lack of long-range order complicates structural characterization and determination of structure-property relationships. Solution deposition approaches are attractive alternatives to traditional vapor-phase deposition methods because precursors are commonly stable in air, and they enable printing and direct lithographic patterning on common semiconductor wafers as well as large-area and flexible substrates - useful for scale-up to applications in windows and photovoltaic devices.
AB - Here, we employ a combination of 27Al solid-state nuclear magnetic resonance (SSNMR) and conventional spectroscopic and microscopic techniques to investigate the structural evolution of aqueous aluminum precursors to a uniform and smooth aluminum oxide film. The route involves no organic ligands and relies on dehydration, dehydroxylation, and nitrate loss for condensation and formation of the three-dimensional aluminum oxide structure. Local chemical environments are tracked as films evolve over the temperature range 200-1100 °C. 27Al SSNMR reveals that Al centers are predominantly four- and five-coordinate in amorphous films annealed between 200 and 800 °C and four- and six-coordinate in crystalline phases that form above 800 °C. The Al coordination of the aqueous-deposited aluminum oxide films are compared to data from SSNMR studies on vapor-phase-deposited aluminum oxide thin films. Additionally, dielectric constants of aluminum oxide-based capacitors are measured and correlated with the SSNMR results. Aluminum oxide is an important material for protective coatings, catalysis, and microelectronic applications. For the latter application, amorphous materials are preferred, but a lack of long-range order complicates structural characterization and determination of structure-property relationships. Solution deposition approaches are attractive alternatives to traditional vapor-phase deposition methods because precursors are commonly stable in air, and they enable printing and direct lithographic patterning on common semiconductor wafers as well as large-area and flexible substrates - useful for scale-up to applications in windows and photovoltaic devices.
UR - https://www.scopus.com/pages/publications/85055324958
U2 - 10.1021/acs.chemmater.7b05078
DO - 10.1021/acs.chemmater.7b05078
M3 - Article
AN - SCOPUS:85055324958
SN - 0897-4756
VL - 30
SP - 7456
EP - 7463
JO - Chemistry of Materials
JF - Chemistry of Materials
IS - 21
ER -