TY - GEN
T1 - 17.11 A 9mW Ultrasonic Through Transmission Transceiver for Non-Invasive Intracranial Pressure Sensing
AU - Topalli, Gerald
AU - Fan, Yingying
AU - Cheung, Matt Y.
AU - Veeraraghavan, Ashok
AU - Hirzallah, Mohammad
AU - Chi, Taiyun
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Intracranial pressure (ICP) measures the pressure exerted by fluids and tissues inside the skull, typically 7-15mmHg for healthy adults. Conditions such as traumatic brain injury, hydrocephalus, and intracranial hemorrhage often cause elevated ICP (>20mmHg), which is life-threatening and requires immediate medical interventions. These conditions also lead to changes in the ICP waveform morphology, especially an increased P2/P1 amplitude ratio, reflecting compromised cerebral compliance [1] (Fig. 17.11.1, top left). Clinicians routinely use ICP monitoring in neurovascular intensive care units (neuro-ICUs) because it provides actionable and timely information for patient care - the recovery of the ICP waveform morphology often suggests effective medical interventions.
AB - Intracranial pressure (ICP) measures the pressure exerted by fluids and tissues inside the skull, typically 7-15mmHg for healthy adults. Conditions such as traumatic brain injury, hydrocephalus, and intracranial hemorrhage often cause elevated ICP (>20mmHg), which is life-threatening and requires immediate medical interventions. These conditions also lead to changes in the ICP waveform morphology, especially an increased P2/P1 amplitude ratio, reflecting compromised cerebral compliance [1] (Fig. 17.11.1, top left). Clinicians routinely use ICP monitoring in neurovascular intensive care units (neuro-ICUs) because it provides actionable and timely information for patient care - the recovery of the ICP waveform morphology often suggests effective medical interventions.
UR - https://www.scopus.com/pages/publications/85188078651
U2 - 10.1109/ISSCC49657.2024.10454476
DO - 10.1109/ISSCC49657.2024.10454476
M3 - Conference contribution
AN - SCOPUS:85188078651
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 334
EP - 336
BT - 2025 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
Y2 - 18 February 2024 through 22 February 2024
ER -